Transparency Market Research Reports included a detailed market survey and analysis trends on “Semiconductor & IC Packaging Materials Market”. This report also includes more info about basic overview of the industry including definitions, applications and global market industry structure.Semiconductor and IC Packaging materials are used to
guard the electronics components like IC’s and semiconductors from
corrosion and external impact. These materials are used along with the
several advanced packaging technologies for the packaging of IC’s and
semiconductors. The packaging material performs the final stage of
semiconductor device fabrication by placing the boards or dies inside
the protective package to provide the pins or connectors for connection.
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In
the span of four years i.e. from 2010 to 2014, product development was
the main growth approach adopted by the IC’s and semiconductor packaging
materials industry. In the first six months of 2013, the Henkel AG has
completed four products. Further, the company was acquired by Hitachi
Chemical Co. Ltd., and the expansion has been done by Henkel AG &
Company and Hitachi Chemical Co. Ltd. collectively. Atotech Deutschland
and Sumitomo Chemical Co. Ltd. are the further key participants in the
development activities during this period. The other active players in
market development of IC’s and semiconductor packaging materials are
Indium Corp. and Shinko Electric Industries Co. Ltd.
Some
of the factors driving the growth of semiconductor & IC packaging
materials market include increase in the research and development
efforts to make the electronic packaging materials highly resourceful,
the enormous demand from the electronic component companies due to
amplified population that finds electronic packaging materials useful in
a myriad of applications. The materials are well perceived in various
dominant end-user markets in the last few decades, and are expected to
be used for diverse applications in the future
The
semiconductor & IC packaging materials market is segmented on the
basis of its types which include solder balls, organic substrates,
leadframes, bonding wires, encapsulation resins, die attach materials,
ceramic packages, thermal interface materials and others (mold
compounds). These materials are produced with numerous types of
packaging technologies which includes SP, power QFN, DFN and GA. Organic
substrate segment contributes the most in the global market and is
extensively used as foundation materials for the packaging of Integrated
Circuits (IC’s) and semiconductors. The bonding wire segment mostly of
gold has been generally used as packaging materials, but recently there
has been a change towards copper bonding wires. Encapsulation resin
segment is comparatively new types of packaging materials for IC’s and
semiconductors and due to this the segment is expected to grow
aggressively in the next five years. In addition, the market could be
segmented on the basis of geography which includes North
America, Europe, Asia-Pacific and RoW.
Some
of the key players that are dominating this market are Alent PLC,
Kyocera Chemical Co. Ltd., Hitachi Chemical Co. Ltd., LG Chemical Ltd.,
Basf SE, Sumitomo Chemical Co. Ltd., Henkel Ag & Company, Mitsui
High-Tec Inc., Tanaka Holdings Co. Ltd. and Toray Industries Corporation
among others.
This research report analyzes this market depending on its market segments, major geographies, and current market trends. Geographies analyzed under this research report include
- North America
- Asia Pacific
- Europe
- Rest of the World
This report provides comprehensive analysis of
- Market growth drivers
- Factors limiting market growth
- Current market trends
- Market structure
- Market projections for upcoming years
Transparency
Market Research (TMR) is a market intelligence company providing global
business research reports and consulting services. Our exclusive blend
of quantitative forecasting and trends analysis provides forward-looking
insights for thousands of decision-makers.
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